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SMBB Round Wire
● SMBB (Super Multi-Busbar) ribbon is a cylindrical interconnect ribbon ● Copper Material: Tu1, purity ≥99.97%● With a wire diameter of 0.23mm-0.26 mm● Mainly used in N-type modules with 16 or more
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Copper-Clad Aluminum Ribbon
● Consists of an aluminum core coated with a layer of copper● Significant weight reduction: Density is about 37% of pure copper; much lighter at equal length● At the same gauge and weight, ribbon
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Black Bus Bar Ribbon
● Copper Material: Tu1, purity ≥99.97%● Integrated appearance: Uniform black appearance visually matches black frames/backsheets for high aesthetics● Bulk Cu conductivity retained：Surface-only
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Reflective Bus Bar Ribbon
● Copper Material: Tu1, purity ≥99.97%● Features a specific V-groove structural design● Enabling secondary reflection of sunlight to increase energy output● Ensures the reflective gain and the
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Class 180 Directly Solderable Enamelled Flat Wire
● Telison's UEW is a directly solderable flat enameled wire with a polyurethane insulating layer and a rectangular conductor. ● The Only Direct-Solder Base Film In The Catalog - polyurethane film
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Class 220 Polyamide Imide Enamelled Flat Wire
● Telison's AIW features polyamide-imide (AIW) as the insulating layer, applied via a multi-coating process● Can withstand continuous operation at 220°C and the tension of high-speed winding●
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Copper Clad Aluminum Flat Enamelled Wire
● Telison's Copper-Clad Aluminum (CCA) flat enamelled wire is a composite conductor featuring an aluminum core sheathed with an outer copper layer. ● This design combines the superior conductivity of
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Class 240 Self Bonding Enamelled Flat Wire
● Ultimate Thermal Resistance: Temperature index as high as 240°C (Class C), the only series member to reach IEC 60085 Class C, with breakdown voltage ≥700 V and thermal-shock ≥260 °C● Outstanding
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Class 220 Self Bonding Enamelled Flat Wire
● 220°C Thermoset Bond Strength — Class 220 base + thermoset cross-linking bond; far higher bond strength at temperature than thermoplastic self-bonding wires; suitable for 180–200 °C long-term duty●
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Class 180 Self Bonding Enameled Flat Wire
● Telison's HB-UEW is developed based on the UEW/180 wire, an outer solvent-based or thermoplastic bondable overcoat is applied. ● Self-Bonding: layers bond upon heating (approx. 170°C) or alcohol
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Class 200 Composite Enamelled Flat Wire
● Telison's EI/AIW utilizes a polyester-imide / polyamide-imide composite coating process● Catalog-Leading Slot Fill (82–92%) — rectangular cross-section + composite film packs ~20% more conductor
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Class 200 Self Bonding Composite Enamelled Flat Wire
● HB-AIW/200 sits in the middle of Telison's HB family ● EI / AIW Dual-Layer Base — polyester-imide undercoat + polyamide-imide overcoat; industry-standard composite for balanced thermal / mechanical
