HB-UEW is Telison's volume-tier self-bonding flat wire - built on a Class 180 solderable polyurethane (UEW) base with a thin alcohol/heat-activated bond coat. It is the only wire in our HB family that lets you both solder (390 °C ± 5 °C, no stripping) and self-bond (~170 °C hot air or alcohol dip) on the same coil, cutting your voice-coil, RFID and HF-inductor lines from a two-stage process to one. We run dedicated alcohol-bonding lines for HB-UEW - enough consistency to feed your high-speed automatic winders without re-tensioning.
Description
HB-UEW is the workhorse of Telison's self-bonding family and the lowest-cost member of the HB pyramid. It pairs a Class 180 polyurethane base (the only base film in our catalog that can be soldered directly) with a sub-10 µm bond coat whose chemistry has been tuned for high-speed bobbin-less winding. Telison's HB-UEW volume maily goes into voice-coil and HF-inductor lines.
The core driver behind HB-UEW is the dual efficiency revolution of 'impregnation-free + solderable': the polyurethane base film can be directly soldered at about 390 ℃ without film stripping, while the bond coat allows one-shot coil after winding. Traditional voice-coil and HF-inductor lines first bond the turns, then strip-and-solder the terminations; the polyurethane base film lets the same coil be direct-soldered at 390 °C ±5 °C without enamel stripping, while the bond coat lets the coil be finished in a single pass after winding. Stacking those two shortcuts enables fully automated production of consumer-electronics-grade coils.
The overcoat exhibits excellent chemical compatibility with the underlying insulation layer, and the bonded assembly demonstrates improved moisture resistance. After winding, coils can be formed without the need for a supporting mold, thereby reducing processing time. Primary applications include wireless charging coils, micro-relays and sealed solenoid valve coils, RFID tag antennas, and high-frequency air-core inductors.
Features
- Telison's HB-UEW is developed based on the UEW/180 wire, an outer solvent-based or thermoplastic bondable overcoat is applied.
- Direct solderability + self-bondability in one wire - the only catalog product that can be soldered at 390 °C ±5 °C without enamel stripping.
- Bond strength ≥ 0.3 N after cure - bonded coil stays integral during drop and vibration tests
- Low dielectric loss polyurethane film - designed for HF coils up to 13.56 MHz
- Uniform enamel coating application, ensuring superior insulation properties
- Elongation ≥ 30 % on widths from 0.50 to 7.00 mm - survives tight voice-coil wrap without cracking
- Insulation film thickness 0.01–0.04 mm (single side) - keeps slot fill factor high in mini-coils
- Lowest cost in the HB family - UEW base is among the most economical enamel categories; direct-factory pricing removes intermediate margin.
- Telison direct factory pricing - shortest chain between you and the spool
- Primary applications include wireless charging coils, micro-relays and sealed solenoid valve coils, RFID tag antennas, and high-frequency air-core inductors.
- Compliant with NEMA, IEC, JIS, or customer-specified standards
Specifications
Products Size Range: Wide: 0.50-7.00mm Thickness: 0.08-1.60mm Minimum Insulation Thickness: 0.01mm(Single Side)
| UEW/180 | |||||
| Thermal Class | 180 | ||||
| Thermal Shock Temperature | ≥200℃ | ||||
| Breakdown Voltage | ≥700V | ||||
| Elongation | ≥30% | ||||
| Bond strength | ≥0.3 N | ||||
| Bondability | Self-bonding | ||||
| Solderability | 390℃±5℃ | ||||
| Compliance | NEMA MW1000 / IEC 60317 series / GB/T 7095 | ||||
| Certification | SGS- and UL-certified | ||||
Manufacturing Scope of Flat Wire
Certificate
The product has been certificated by SGS and UL
Application
With low cost and solderability, HB-UEW will keep commanding the largest-volume, mid-to-low tier of this market：
- Loudspeaker and earphone voice coils - acoustic devices account for 35% of global self-bonding wire demand, the largest single application; alcohol/hot-air bonding enables high-speed bobbin-less voice-coil winding.
- Coreless (ironless) motor windings - the structure of choice for humanoid-robot dexterous hands, drones and medical micro-motors.
- SMD power inductors & LAN transformers - direct solderability removes film-stripping step
- Bobbin-less coils of relays, solenoids and electromagnets.
- Micro brushed-DC armatures.Loudspeaker and earphone voice coils,wireless charging coils, micro-relays and sealed solenoid valve coils, RFID tag antennas, and high-frequency air-core inductors.
FAQ
Q: What is the core structure of Class 180 Polyurethane Self-Bonding Enamelled Flat Wire?
A: This wire adopts Class 180 solderable polyurethane as the main insulation base, with an extra alcohol/heat dual-activated self-bonding coat on the outer layer. The enamel tolerance controlled within ±0.005mm, fully complying with Class 180 thermal endurance standard.
Q: Can this wire be directly soldered without enamel stripping?
A: Absolutely yes. At the soldering temperature of 390℃ ±5℃, the polyurethane base enamel can be directly volatilized by heat, no pre mechanical grinding or chemical enamel stripping treatment is required, which greatly improves soldering production efficiency.
Q: Is there any MOQ limit for sample application of this product?
A: Samples can be fully customized and provided according to customers' actual testing requirements, there is no minimum order quantity requirement.
Q: What are its typical application scenarios?
A: It is widely used in Hi-Fi speaker voice coils, RFID antenna coils, high-frequency inductors, micro precision motor windings and other scenarios. It can convert the traditional two-stage coil manufacturing process into one single step, greatly simplifying the production flow.
Q: Do you provide test report with shipment
A: Yes - every shipment carries a test report.
Q: Comparison vs HB-AIW/220?
A: HB-UEW is solderable, costs ~30 % less, and tops out at 180 °C; HB-AIW/220 is non-solderable but handles 220 °C and oil-cooling duty.
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