Telison has pioneered the adoption of industry-leading, fully automated flat enameled wire production equipment. The facility currently operates multiple integrated automated production lines, specializing in precision miniature enameled flat copper wire, high-performance copper-clad aluminum enameled wire, and lead-free tinned flat copper wire. Our products offer diverse temperature resistance ratings up to 240℃, and customization options are available for clients.
Description
Flat enameled wire refers to a winding wire produced by drawing, extruding, or rolling an oxygen-free copper rod through a die of specific specifications, followed by multiple coating applications of insulating varnish. The "flat" in flat enameled wire denotes the material's shape. Compared to enameled round copper wire or enameled hollow copper wire, flat enameled wire exhibits excellent insulation and corrosion resistance.
Telison's HB-UEW is developed based on the UEW/180 wire, an outer solvent-based or thermoplastic bondable overcoat is applied. Bonding can be activated by heat or solvent. This overcoat exhibits excellent chemical compatibility with the underlying insulation layer, and the bonded assembly demonstrates improved moisture resistance. After winding, coils can be formed without the need for a supporting mold, thereby reducing processing time. Primary applications include wireless charging coils, micro-relays and sealed solenoid valve coils, RFID tag antennas, and high-frequency air-core inductors.


Features
- Telison's HB-UEW is developed based on the UEW/180 wire, an outer solvent-based or thermoplastic bondable overcoat is applied.
- Bonding can be activated by heat or solvent
- The overcoat exhibits excellent chemical compatibility with the underlying insulation layer
- Excellent solderability and high resisitance at 390°C±5℃
- High mechanical strength and excellent vibration resistance.
- After winding, coils can be formed without the need for a supporting mold, thereby reducing processing time.
- Uniform enamel coating application, ensuring superior insulation properties
- Excellent winding performance and bendability, with elongation exceeding 30%
- Primary applications include wireless charging coils, micro-relays and sealed solenoid valve coils, RFID tag antennas, and high-frequency air-core inductors.
- Compliant with NEMA, IEC, JIS, or customer-specified standards
Specifications
|
HB-UEW |
|||||
|
Thermal Class |
Thermal Shock Temperature GB/T 7095.5-7 IEC 60317-27-29 |
Breakdown Voltage GB/T 7095.5-7 IEC 60317-27-29 |
Elongation IEC 60317-0-2 |
Solderability |
Bondability |
|
180℃ |
≥200℃ |
≥700V |
≥30% |
390℃±5℃ |
Self-bonding |
Product Dimensions and performance standards
Products Size Range: Wide: 0.50-7.00mm Thickness: 0.08-1.60mm Minimum Insulation Thickness: 0.01mm(Single Side)
Wire Types: UEW, EI/AIW, AIW, PIW,HB-UEW, HB-EI/AIW, HB-AIW, HB-PIW
|
Number |
Size(mm) |
Thickness( With Paint Film,mm) |
Wide Range( With Paint Film,mm) |
Breakdown Voltage(V) |
Elongation(%) |
Bondability(N) |
|
1 |
0.08*0.80 |
MAX≤0.14 |
MAX≤0.91 |
≥700V |
≥30 |
≥0.3 |
|
2 |
0.10*1.00 |
MAX≤0.16 |
MAX≤1.11 |
≥700V |
≥30 |
≥0.3 |
|
3 |
0.11*1.20 |
MAX≤0.17 |
MAX≤1.31 |
≥700V |
≥30 |
≥0.3 |
|
4 |
0.13*1.00 |
MAX≤0.19 |
MAX≤1.11 |
≥700V |
≥30 |
≥0.3 |
|
5 |
0.15*1.00 |
MAX≤0.21 |
MAX≤1.11 |
≥700V |
≥30 |
≥0.3 |
|
6 |
0.15*1.20 |
MAX≤0.21 |
MAX≤1.31 |
≥700V |
≥30 |
≥0.3 |
|
7 |
0.15*1.50 |
MAX≤0.21 |
MAX≤1.61 |
≥700V |
≥30 |
≥0.3 |
|
8 |
0.15*2.00 |
MAX≤0.21 |
MAX≤2.11 |
≥700V |
≥30 |
≥0.3 |
|
9 |
0.16*1.45 |
MAX≤0.22 |
MAX≤1.51 |
≥700V |
≥30 |
≥0.3 |
|
10 |
0.18*1.00 |
MAX≤0.24 |
MAX≤1.11 |
≥700V |
≥30 |
≥0.3 |
|
11 |
0.20*1.20 |
MAX≤0.26 |
MAX≤1.31 |
≥700V |
≥30 |
≥0.3 |
|
12 |
0.20*1.50 |
MAX≤0.26 |
MAX≤1.61 |
≥700V |
≥30 |
≥0.3 |
|
13 |
0.20*1.80 |
MAX≤0.26 |
MAX≤1.91 |
≥700V |
≥30 |
≥0.3 |
|
14 |
0.20*2.40 |
MAX≤0.26 |
MAX≤2.51 |
≥700V |
≥30 |
≥0.3 |
|
15 |
0.20*2.50 |
MAX≤0.26 |
MAX≤2.61 |
≥700V |
≥30 |
≥0.3 |
|
16 |
0.25*3.00 |
MAX≤0.31 |
MAX≤3.11 |
≥700V |
≥30 |
≥0.3 |
|
17 |
0.28*3.00 |
MAX≤0.34 |
MAX≤3.11 |
≥700V |
≥30 |
≥0.3 |
|
18 |
0.30*1.20 |
MAX≤0.36 |
MAX≤1.31 |
≥700V |
≥30 |
≥0.3 |
|
19 |
0.30*1.50 |
MAX≤0.36 |
MAX≤1.61 |
≥700V |
≥30 |
≥0.3 |
|
20 |
0.30*2.00 |
MAX≤0.36 |
MAX≤2.11 |
≥700V |
≥30 |
≥0.3 |
|
21 |
0.32*1.80 |
MAX≤0.38 |
MAX≤1.91 |
≥700V |
≥30 |
≥0.3 |
|
22 |
0.34*1.40 |
MAX≤0.40 |
MAX≤1.51 |
≥700V |
≥30 |
≥0.3 |
|
23 |
0.40*1.20 |
MAX≤0.46 |
MAX≤1.31 |
≥700V |
≥30 |
≥0.3 |
|
24 |
0.40*1.50 |
MAX≤0.46 |
MAX≤1.61 |
≥700V |
≥30 |
≥0.3 |
|
25 |
0.40*2.00 |
MAX≤0.46 |
MAX≤2.11 |
≥700V |
≥30 |
≥0.3 |
|
26 |
0.40*3.00 |
MAX≤0.46 |
MAX≤3.11 |
≥700V |
≥30 |
≥0.3 |
|
27 |
0.40*3.30 |
MAX≤0.46 |
MAX≤3.41 |
≥700V |
≥30 |
≥0.3 |
|
28 |
0.40*4.50 |
MAX≤0.46 |
MAX≤4.61 |
≥700V |
≥30 |
≥0.3 |
|
29 |
0.47*3.53 |
MAX≤0.53 |
MAX≤3.64 |
≥700V |
≥30 |
≥0.3 |
|
30 |
0.49*1.60 |
MAX≤0.55 |
MAX≤1.71 |
≥700V |
≥30 |
≥0.3 |
|
31 |
0.50*1.50 |
MAX≤0.56 |
MAX≤1.61 |
≥700V |
≥30 |
≥0.3 |
|
32 |
0.50*1.80 |
MAX≤0.56 |
MAX≤1.91 |
≥700V |
≥30 |
≥0.3 |
|
33 |
0.50*4.50 |
MAX≤0.56 |
MAX≤4.61 |
≥700V |
≥30 |
≥0.3 |
|
34 |
0.60*2.00 |
MAX≤0.66 |
MAX≤2.11 |
≥700V |
≥30 |
≥0.3 |
|
35 |
0.80*3.80 |
MAX≤0.86 |
MAX≤3.91 |
≥700V |
≥30 |
≥0.3 |
|
36 |
0.80*4.00 |
MAX≤0.86 |
MAX≤4.11 |
≥700V |
≥30 |
≥0.3 |
Manufacturing Scope of Flat Wire

Certificate

The product has been certificated by SGS and UL
Application
Telison's HB-UEW Primary applications include wireless charging coils, micro-relays and sealed solenoid valve coils, RFID tag antennas, and high-frequency air-core inductors.



Package
|
Bobbin Type |
Flange Diameter |
Barrel Diameter |
Barrel Length |
Flange Thickness |
Axis Hole |
Standard Weight of Wire Carried |
||||
|
|
P-5 |
160 |
90 |
90 |
12 |
20 |
5.0±1 |
|||
|
P-10 |
200 |
90 |
110 |
12 |
25 |
9.0+5 |
||||
|
P-30 |
300 |
130 |
130 |
15 |
31 |
25.0+ 10 |
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