For flexible, perovskite and lightweight PV modules, Telison ultra-thin busbar cold-rolls Tu1 OFC copper down to 0.10–0.25 mm thickness with widths up to 4–12 mm, delivering low yield strength, foldability and material savings.
Description
Next-generation PV - perovskite single-junction or tandem, flexible thin-film, BIPV curved façades, vehicle-integrated and portable PV - demands interconnect materials far thinner, softer and more fatigue-resistant than legacy ribbons.
Telison's ultra-thin bus bar ribbon delivers the current-collection function of a conventional PV busbar at less than half the cross-section. Cold-rolled from Tu1 oxygen-free high-conductivity copper (≥99.97% purity) to a thickness of just 0.10-0.25 mm. Compared with a standard 0.20-0.45mm ribbon, it cuts module mass and shading loss, making it the preferred busbar material for perovskite-on-glass, BIPV curved surfaces, and portable PV chargers. It is supplied in continuous spool lengths, with widths from 4.00 mm to 12.00 mm and is ready for automated stringers.
Features
- Copper Material: Tu1, purity ≥99.97%
- Using a new technology that can obtains ultra-thin size
- Lightweight: Significantly reduces module weight, easing installation, transport and flexible applications
- High-precision tolerance: Precision rolling ensures thickness uniformity and dimensional consistency
- Conductivity retained: Thin yet conductive, with stable current collection and transmission
- Mainly used in flexible cell and perovskite cell modules
- Customization is acceptable
Specifications
- Copper Material: Tu1, purity ≥99.97%
- Solder Coating: According to customer's requirement
- Scope of Width: 4.00mm-12.00mm
- Scope of Thickness: 0.10mm-0.25mm
Application
The ultra-thin bus bar is mainly used in flexible cell and perovskite cell modules and it can improve the connection strength between cells to ensure the smooth output of module current.
FAQ
Q: Exactly how thin is the ultra-thin busbar?
A: Telison ultra-thin bus bar: 0.10–0.25 mm thickness - roughly half the thickness of a standard 0.20–0.45 mm busbar. Width 4–12 mm to cover perovskite-on-glass (6–10 mm) and flexible thin-film (4–6 mm).
Q: Which applications does the ultra-thin busbar support?
A: The ultra-thin bus bar is mainly used in flexible cell and perovskite cell modules.
Q: Does it support HJT low-temperature soldering?
A: Yes. SnBi / SnAg low-temp coatings keep peak soldering ≤170°C, which combined with the ultra-thin substrate suits low-heat-budget architectures.
Q: Can the ultra-thin busbar reduce silver-paste consumption?
A: Yes. In 0BB / SMBB designs, Ag finger paste consumption is inversely related to ribbon width. Replacing a 6–8 mm busbar with a 4–6 mm ultra-thin busbar reduces per-module Ag paste use.
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