Telison has pioneered the adoption of industry-leading, fully automated flat enameled wire production equipment. The facility currently operates multiple integrated automated production lines, specializing in precision miniature enameled flat copper wire, high-performance copper-clad aluminum enameled wire, and lead-free tinned flat copper wire. Our products offer diverse temperature resistance ratings up to 240℃, and customization options are available for clients.
Description
Flat enameled wire refers to a winding wire produced by drawing, extruding, or rolling an oxygen-free copper rod through a die of specific specifications, followed by multiple coating applications of insulating varnish. The "flat" in flat enameled wire denotes the material's shape. Compared to enameled round copper wire or enameled hollow copper wire, flat enameled wire exhibits excellent insulation and corrosion resistance.
Telison's AIW This product features polyamide-imide (AIW) as the insulating layer, applied via a multi-coating process. The conductor is a rectangular cross-section copper or aluminum flat wire. It can withstand a continuous operating temperature of 220°C and the tension during high-speed winding. The product offers high thermal stability, excellent corona resistance, and strong film adhesion. Compared to traditional polyester or polyester-imide insulated wires, it is better suited for high-temperature environments. Primary applications include high-end chip inductors for mobile phones, PV inverters, motors, charging piles, and other critical components.
Features
- Telison's AIW features polyamide-imide (AIW) as the insulating layer, applied via a multi-coating process
- Can withstand a continuous operating temperature of 220°C and the tension during high-speed winding
- High-Temperature Endurance & Stability
- Superior Mechanical & Electrical Performance
- Excellent corona resistance and advanced Material & Construction
- Uniform enamel coating application, ensuring superior insulation properties
- Compared to traditional polyester or polyester-imide insulated wires, it is better suited for high-temperature environments
- Excellent winding performance and bendability, with elongation exceeding 30%
- Primary applications include high-end chip inductors for mobile phones, PV inverters, motors, charging piles, and other critical components.
- Compliant with NEMA, IEC, JIS, or customer-specified standards
Specifications
|
AIW |
|||||
|
Thermal Class |
Thermal Shock Temperature GB/T 7095.5-7 IEC 60317-27-29 |
Breakdown Voltage GB/T 7095.5-7 IEC 60317-27-29 |
Elongation IEC 60317-0-2 |
Solderability |
Bondability |
|
220℃ |
≥240℃ |
≥700V |
≥30% |
Non-solderable |
Non-bondable |
Product Dimensions and performance standards
Products Size Range: Wide: 0.50-7.00mm Thickness: 0.08-1.60mm Minimum Insulation Thickness: 0.01mm(Single Side)
Wire Types: UEW, EI/AIW, AIW, PIW,HB-UEW, HB-EI/AIW, HB-AIW, HB-PIW
|
Number |
Size(mm) |
Thickness( With Paint Film,mm) |
Wide Range( With Paint Film,mm) |
Breakdown Voltage(V) |
Elongation(%) |
Bondability(N) |
|
1 |
0.08*0.80 |
MAX≤0.14 |
MAX≤0.91 |
≥700V |
≥30 |
≥0.3 |
|
2 |
0.10*1.00 |
MAX≤0.16 |
MAX≤1.11 |
≥700V |
≥30 |
≥0.3 |
|
3 |
0.11*1.20 |
MAX≤0.17 |
MAX≤1.31 |
≥700V |
≥30 |
≥0.3 |
|
4 |
0.13*1.00 |
MAX≤0.19 |
MAX≤1.11 |
≥700V |
≥30 |
≥0.3 |
|
5 |
0.15*1.00 |
MAX≤0.21 |
MAX≤1.11 |
≥700V |
≥30 |
≥0.3 |
|
6 |
0.15*1.20 |
MAX≤0.21 |
MAX≤1.31 |
≥700V |
≥30 |
≥0.3 |
|
7 |
0.15*1.50 |
MAX≤0.21 |
MAX≤1.61 |
≥700V |
≥30 |
≥0.3 |
|
8 |
0.15*2.00 |
MAX≤0.21 |
MAX≤2.11 |
≥700V |
≥30 |
≥0.3 |
|
9 |
0.16*1.45 |
MAX≤0.22 |
MAX≤1.51 |
≥700V |
≥30 |
≥0.3 |
|
10 |
0.18*1.00 |
MAX≤0.24 |
MAX≤1.11 |
≥700V |
≥30 |
≥0.3 |
|
11 |
0.20*1.20 |
MAX≤0.26 |
MAX≤1.31 |
≥700V |
≥30 |
≥0.3 |
|
12 |
0.20*1.50 |
MAX≤0.26 |
MAX≤1.61 |
≥700V |
≥30 |
≥0.3 |
|
13 |
0.20*1.80 |
MAX≤0.26 |
MAX≤1.91 |
≥700V |
≥30 |
≥0.3 |
|
14 |
0.20*2.40 |
MAX≤0.26 |
MAX≤2.51 |
≥700V |
≥30 |
≥0.3 |
|
15 |
0.20*2.50 |
MAX≤0.26 |
MAX≤2.61 |
≥700V |
≥30 |
≥0.3 |
|
16 |
0.25*3.00 |
MAX≤0.31 |
MAX≤3.11 |
≥700V |
≥30 |
≥0.3 |
|
17 |
0.28*3.00 |
MAX≤0.34 |
MAX≤3.11 |
≥700V |
≥30 |
≥0.3 |
|
18 |
0.30*1.20 |
MAX≤0.36 |
MAX≤1.31 |
≥700V |
≥30 |
≥0.3 |
|
19 |
0.30*1.50 |
MAX≤0.36 |
MAX≤1.61 |
≥700V |
≥30 |
≥0.3 |
|
20 |
0.30*2.00 |
MAX≤0.36 |
MAX≤2.11 |
≥700V |
≥30 |
≥0.3 |
|
21 |
0.32*1.80 |
MAX≤0.38 |
MAX≤1.91 |
≥700V |
≥30 |
≥0.3 |
|
22 |
0.34*1.40 |
MAX≤0.40 |
MAX≤1.51 |
≥700V |
≥30 |
≥0.3 |
|
23 |
0.40*1.20 |
MAX≤0.46 |
MAX≤1.31 |
≥700V |
≥30 |
≥0.3 |
|
24 |
0.40*1.50 |
MAX≤0.46 |
MAX≤1.61 |
≥700V |
≥30 |
≥0.3 |
|
25 |
0.40*2.00 |
MAX≤0.46 |
MAX≤2.11 |
≥700V |
≥30 |
≥0.3 |
|
26 |
0.40*3.00 |
MAX≤0.46 |
MAX≤3.11 |
≥700V |
≥30 |
≥0.3 |
|
27 |
0.40*3.30 |
MAX≤0.46 |
MAX≤3.41 |
≥700V |
≥30 |
≥0.3 |
|
28 |
0.40*4.50 |
MAX≤0.46 |
MAX≤4.61 |
≥700V |
≥30 |
≥0.3 |
|
29 |
0.47*3.53 |
MAX≤0.53 |
MAX≤3.64 |
≥700V |
≥30 |
≥0.3 |
|
30 |
0.49*1.60 |
MAX≤0.55 |
MAX≤1.71 |
≥700V |
≥30 |
≥0.3 |
|
31 |
0.50*1.50 |
MAX≤0.56 |
MAX≤1.61 |
≥700V |
≥30 |
≥0.3 |
|
32 |
0.50*1.80 |
MAX≤0.56 |
MAX≤1.91 |
≥700V |
≥30 |
≥0.3 |
|
33 |
0.50*4.50 |
MAX≤0.56 |
MAX≤4.61 |
≥700V |
≥30 |
≥0.3 |
|
34 |
0.60*2.00 |
MAX≤0.66 |
MAX≤2.11 |
≥700V |
≥30 |
≥0.3 |
|
35 |
0.80*3.80 |
MAX≤0.86 |
MAX≤3.91 |
≥700V |
≥30 |
≥0.3 |
|
36 |
0.80*4.00 |
MAX≤0.86 |
MAX≤4.11 |
≥700V |
≥30 |
≥0.3 |
Manufacturing Scope of Flat Wire
Certificate
The product has been certificated by SGS and UL
Application
Telison's AIW Primary applications include high-end chip inductors for mobile phones, PV inverters, motors, charging piles, and other critical components.
Package
|
Bobbin Type |
Flange Diameter |
Barrel Diameter |
Barrel Length |
Flange Thickness |
Axis Hole |
Standard Weight of Wire Carried |
||||
|
|
P-5 |
160 |
90 |
90 |
12 |
20 |
5.0±1 |
|||
|
P-10 |
200 |
90 |
110 |
12 |
25 |
9.0+5 |
||||
|
P-30 |
300 |
130 |
130 |
15 |
31 |
25.0+ 10 |
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