Description
The Copper-clad Aluminum bus bar from Telison is specifically designed for the latest new technology , and the product consists of an aluminum core coated with a layer of copper, and a metallurgical bond is formed through the drawing process to obtain a copper-aluminum coated bimetallic composite substrate, this ribbon has stable performance, and the length of ribbon is increased under the same wire diameter and weight.
Compared with pure copper ribbon, it offering excellent conductivity and cost-effectiveness. A variety of copper-aluminum composite ratios and coating components are available. This innovative product can also be applicable for TopCon,BC,and HJT Module with customized material and coating solutions based on customer's requirements.
Features
- Metallurgical bimetallic bond ：Cu–Al composite interface formed by drawing, eliminating plating-peel risk
- Lightweight by design：Density ≈37% of Cu; reduces module shipping & installation cost per watt
- Customizable ratio & coating：Cu-Al ratio, thickness and solder coating tuned to your process
- N-type ready-TopCon / BC / HJT：Validated in mass production on TopCon / BC / HJT lines
- Test Report could be offered upon request.
Specifications
- Solder coating: Sn/Pb; Sn/Pb/Bi and Lead-free solder strips are optional
- Copper-aluminum ratios: According to customer's requirement
- Scope of Width: 4.00mm-8.00mm
- Scope of Thickness: 0.20mm-0.45mm
Application
The Copper-clad Aluminum bus bar can be applicable for TopCon,BC,and HJT Module
with customized material and coating solutions based on customer's requirements
TopCon n Modules
TopCon n-type modules
BC Modules
Back-contact modules
HJT Modules
HJT heterojunction modules
BIPV
BIPV & lightweight rooftops
FAQ
Q: How much copper can a CCA busbar save versus a pure-copper busbar?
A: Compared to a pure-Cu busbar of the same dimension (e.g. 4 mm × 0.25 mm), the CCA busbar contains only ~30–40% copper by volume.
Q: Is the Cu-Al interface electroplated or metallurgically bonded? Does it delaminate easily?
A: Telison CCA busbar uses a continuous drawing process to form a true Cu–Al metallurgical bond - not an electroplated layer. The bond survives IEC 61215 TC 200 cycles without delamination.
Q: Can the Cu-Al ratio (copper-layer share) be customized?
A: Yes. The Cu-Al ratio and Sn / SnPb / SnAg coating chemistry configurable per customer stringer and reliability plan.
Q: Which cell technologies does the CCA busbar support?
A: Validated in mass production for TopCon, Back-Contact (BC) and HJT cells, and also compatible with PERC lines. For HJT, choose the SnBi low-temp coating to keep soldering ≤170°C.
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