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Low-Temperature PV Ribbon
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Low-Temperature PV Ribbon

Low-Temperature PV Ribbon

● Copper Material: Tu1, purity ≥99.97% ● Using a special low-temperature alloy immersion plating
● Low soldering temperature: Melting point ≤170°C, protecting the HJT low-temperature process window
● Lower microcrack/chip rate: Thermal stress greatly reduced; cell microcracking and chipping are markedly lowered
● Energy saving: Lower stringer temperature setting and energy consumption; shorter cycle timeSpecifically designed for HJT (Hetero-junction Technology)
● Low-temperature silver-paste compatible: Best compatibility with HJT low-temperature silver paste and TCO layers
● Reliable under thermal cycling: Lower solder-joint stress improves module thermal-cycling reliability
● Suitable for low-temperature welding process.
● Mainly used in HJT cells modules, and also used in Topcon and IBC cells modules
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Product Introduction

Description

The Low-temperature pv ribbon from Telison is specifically designed for HJT (Hetero-junction Technology) applications. Using a special low-temperature alloy immersion plating, it can achieve low-temperature soldering (below 170°) under the stable performance.HJT's low-temperature silver paste and TCO layers are sensitive to soldering temperature, so low-temperature bonding markedly reduces the impact of welding heat on the cells, which is beneficial to the thinning of cells and reducing risk of hidden cracks, suitable for low-temperature welding process. The Low-temperature pv ribbon is mainly used in HJT cells modules, and also used in Topcon and IBC cells modules.

product-1000-667

Features

  • Copper Material: Tu1, purity ≥99.97%
  • Low soldering temperature: Melting point ≤170°C, protecting the HJT low-temperature process window
  • Lower microcrack/chip rate: Thermal stress greatly reduced; cell microcracking and chipping are markedly lowered
  • Energy saving: Lower stringer temperature setting and energy consumption; shorter cycle time
  • Low-temperature silver-paste compatible: Best compatibility with HJT low-temperature silver paste and TCO layers
  • Reliable under thermal cycling: Lower solder-joint stress improves module thermal-cycling reliability
  • Mainly used in HJT modules,and also used in Topcon and IBC modules.
  • Customization is acceptable, test report could be offered upon request

Specifications

● Copper Material: Tu1, purity ≥99.97%

● Solder Coating: A special low-temperature alloy immersion plating

 

Low Temperature

Scope of Dimension(mm)

Diameter

Width

Thickness

Round Ribbon

0.16-0.35

 

 

Connection Ribbon

 

0.50-2.00

0.15-0.25

Bus Ribbon

 

4.00-12.00

0.20-0.45

 

Application

The Low-temperature pv ribbon is mainly used in HJT heterojunction modules (including low-temperature SMBB/0BB interconnection) and IBC or other temperature-sensitive N-type high-efficiency cells; a critical enabler for HJT mass production, efficiency improvement and cost reduction.

 

product-1000-667

 

Package,Transportation, Storage

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Package

  • In order to ensure the goods safety during transportation , Telison introduced customized wooden or carton box as outer package with label on it and packing list inside the box.
  • Inner package are uniformly introduced corrugated cartons.
  • Each spool is sealed with a vacuum bag and light weight material filled between them to avoid fretting and banking during transportation.
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Transportation

  • Mechanical cargo handling shall be adopted. All carton packaging are fixed with wooden pallet. Same height and quantity of each pallet without ultrahigh shelved.
  • Telison logistics department will use the best shipping method delivering the goods to the customer designated locations.
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Storage

  • PV ribbon should be properly kept in dry ventilation,
  • No acid-base or harmful gas.
  • With indoor relative humidity not more than 60%.

 

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