Multi Busbar MBB Ribbon

The interconnection ribbon is primarily used to electrically connect individual solar cells in series, transmitting the generated current.

Before MBB, crystalline-silicon modules typically used 2–5 busbars with flat ribbons.Flat ribbons have two inherent drawbacks: first, their wide flat surface directly shades the cell, causing optical loss; second, with few busbars, current must travel a long lateral distance along the fingers before being collected, incurring large series-resistance losses. 

MBB (Multi-Busbar) ribbon is a cylindrical interconnect ribbon for multi-busbar modules (typically 9–15 busbars), upgrading the traditional 5BB flat ribbon. MBB enhancing efficiency by increasing gridline count and optimizing the optical-electrical balance. The round cross-section design reduces the front-side shading, since the curved surface reflects more incident light back to the cell for secondary absorption and cut silver paste consumption. And the uniform soldering contact reduces hot-spot risk, ensuring better long-term reliability. By around 2020 it had shifted from a premium option to the mainstream standard for new production lines. In 2023, MBB ribbons represented roughly 60% of total ribbon demand.

MBB round ribbons use high-purity oxygen-free copper wire as the substrate. They feature low yield strength and high tensile strength, and are suited to mass soldering on automatic stringers. MBB round ribbons are applied across mainstream PV module manufacturing scenarios.

Features

• The MBB round wire is made from TU1 copper after rolling and hot dipping process by automatic tinning machine.
• Higher optical gain：Fine round wire shades far less than flat ribbon, enlarging the effective light-receiving area.
• Higher module power：Reduced reflection, leakage and absorption losses together lift module power by roughly 5–10 W versus 5BB designs, an efficiency gain of 0.3–0.6%
• Silver savings: Thinner, narrower busbars cut front-side silver paste consumption, materially lowering cell non-silicon cost (silver paste is the second-largest cost item after silicon)
• Customization is acceptable
• Test Report could be offered upon request.

Specifications

• Copper Material: Tu1, purity ≥99.97%
• Solder Coating: According to customer's requirement
• Scope of Diameter : 0.265mm-0.35mm
• Busbar count: 9–15 busbars

 

Application

The MBB round wire is ideal for Topcon applications and other new process module, covering mass-produced utility-scale and rooftop modules, providing excellent conductivity and reliability,  also the platform on which SMBB technology is built.

Package

• In order to ensure the goods safety during transportation , Telison introduced customized wooden or carton box as outer package with label on it and packing list inside the box.
• Inner package are uniformly introduced corrugated cartons.
• Each spool is sealed with a vacuum bag and light weight material filled between them to avoid fretting and banking during transportation.

Transportation

• Mechanical cargo handling shall be adopted. All carton packaging are fixed with wooden pallet. Same height and quantity of each pallet without ultrahigh shelved.
• Telison logistics department will use the best shipping method delivering the goods to the customer designated locations.

Storage

• PV ribbon should be properly kept in dry ventilation,
• No acid-base or harmful gas.
• With indoor relative humidity not more than 60%.

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