0BB Round Wire

The interconnection ribbon is primarily used to electrically connect individual solar cells in series, transmitting the generated current. 

0BB (Zero-Busbar / busbar-free) technology removes the busbar electrodes entirely from the cell, keeping only fingers; at the module stage, more numerous, finer copper round ribbons connect directly to the fingers to collect and export current. It was born of the industry's drive toward less- or zero-silver metallization: silver paste is the second-largest cell cost after silicon, so eliminating busbars cuts silver consumption directly and substantially.

The 0BB round wire from Telison is mainly used in the latest 0BB technology which can greatly reduce silver consumption and collecting finger current. On the basis of the original SMBB, the diameter of the 0BB wire has been reduced to 0.2mm and below, which further enhances the conductivity, reduces the shading area, and increases the power of the module than SMBB, giving it higher added value. But the processing of 0BB wire is more difficult.

0BB is regarded by the industry as the core direction of PV "micro-innovation" and a universal cost-down technology for next-generation solar cells. Penetration is accelerating: 0BB ribbons are expected to rise from about 7% of ribbon demand in 2023 to about 14% in 2025; as of March 2025, module makers had filed 575 0BB-related patents (271 in force), with applications surging since 2021-evidence of steadily maturing technology. On technology convergence: 0BB stacks with copper plating and silver-coated-copper pastes. As the supporting ecosystem-high-precision stringers, low-resistance adhesives, high-tensile ribbons-matures, 0BB is expected to shift from an optional optimization to a standard feature of the n-type era, accelerating penetration in high-value scenarios such as high-temperature and distributed markets.

Features

• Copper Material: Tu1, purity ≥99.97%
• Substantial silver savings: Removing busbars cuts silver paste consumption by 20–40%.
• Higher module power: Eliminating busbars reduces shading, while finer and more numerous ribbons shorten current paths and cut resistive loss, typically lifting module power by 3–5 W or more.
• Thin-wafer compatibility and reliability: Supporting wafer thickness down to 110 μm; abundant contact points reduce power degradation and failure risk.

• Simplified process chain: No flux required, compatible with fine ribbons and low-gram-weight films, reducing packaging material usage and equipment maintenance costs.

• Ideal for Topcon, IBC, HJT modules applications and other new process module.

Specifications

• Copper Material: Tu1, purity ≥99.97%
• Solder Coating: According to customer's requirement
• Scope of Diameter : 0.15mm-0.22mm

 

Application

The 0BB round wire is mainly used in the latest 0BB technology, Ideal for Topcon, IBC, HJT modules applications and other new process module.

Package

• In order to ensure the goods safety during transportation, Telison introduced customized wooden or carton box as outer package with label on it and packing list inside the box.
• Inner package are uniformly introduced corrugated cartons.
• Each spool is sealed with a vacuum bag and light weight material filled between them to avoid fretting and banking during transportation.

Transportation

• Mechanical cargo handling shall be adopted. All carton packaging are fixed with wooden pallet. Same height and quantity of each pallet without ultrahigh shelved.
• Telison logistics department will use the best shipping method delivering the goods to the customer designated locations.

Storage

• PV ribbon should be properly kept in dry ventilation.
• No acid-base or harmful gas.
• With indoor relative humidity not more than 60%.

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