Recently, the 26th (South China) China Magnetic Components Industry Intelligent Manufacturing & High-Performance Materials Application Technology Summit was successfully held. The summit was hosted by Big–Bit Business Network and co-organized by the Guangdong Magnetic Components Industry Association, China Magnetic Components Industry Alliance, and Magnetic Components & Power Supply magazine.
Under the theme "Integrated Navigation · Material Innovation · Manufacturing Future," the summit gathered leading enterprises such as Megmeet, Delta, BYD, TDK, and other major players in the magnetic components industry.
At the innovation solutions showcase area held concurrently with the summit, Telison featured its key products, including rectangular enameled wire, high-performance copper-clad aluminum (CCA) flat enameled wire, and HB series self-bonding flat enameled wire. The booth attracted strong interest and frequent inquiries.
face-to-face communication with partners
During the dedicated Supply-Demand Exchange discussion, Telison's technical and sales team for enameled wire engaged in face-to-face communication with multiple partners across the industrial chain.
As the magnetic components industry accelerates its transformation toward high-end, high-precision, and integrated solutions, Telison will leverage the insights gained from this summit to continuously expand its technological innovation capabilities in high-grade flat enameled wire, contributing to the technological advancement of the industry.
